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CPC1708
i4-PACTM DC Power Relay
Parameters Blocking Voltage Load Current, TA=25C With 5C/W Heat Sink No Heat Sink On-resistance RJC
Ratings 60 11.85 4 0.08 0.35
Units VP
Description
Clare and IXYS have combined to bring OptoMOS(R) technology, reliability and compact size to a new family of High Power Solid State Relays. As part of this new family, the CPC1708 1-Form-A DC Solid State Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output is constructed with an efficient MOSFET switch and photovoltaic die that use Clare's patented OptoMOS architecture while the input GaAlAs infrared LED provides the optically-coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications. The unique i4-PAC package pioneered by IXYS allows solid state relays to achieve the highest load current and power ratings. This package features an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low thermal resistance (0.35C/W).
ADC
C/W
Features
* * * * * * * * * 100% Solid State Compact i4-PAC Power Package Low Thermal Resistance (0.35C/W) 11.85ADC Load Current with 5C/W Heat Sink Electrically Non-conductive Thermal Pad for Heat Sink Applications Arc-Free With No Snubbing Circuits 2500Vrms Input/Output Isolation No EMI/RFI Generation Machine Insertable, Wave Solderable
Applications
* * * * * Industrial Controls Motor Control Robotics Medical Equipment--Patient/Equipment Isolation Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Utility Meters (gas, oil, electric and water) * Transportation Equipment * Aerospace/Defense
Approvals
* UL recognized component: File # E69938 * Certified to UL 508
Ordering Information
Part # CPC1708J Description i4-PAC (25 per tube)
Pin Configuration
Switching Characteristics of Normally Open (Form A) Devices
1 + 2 3 4 +
CONTROL
ILOAD
+ 90% 10%+ TON TOFF
RoHS
2002/95/EC
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DS-CPC1708-R01
CPC1708
Absolute Maximum Ratings
Parameter Blocking Voltage Reverse Input Voltage Input control Current Peak (10ms) Input Power Dissipation Isolation Voltage Input to Output Operational Temperature Storage Temperature Ratings 60 5 50 1 150 2500 -40 to +85 -40 to +125 Units VP V mA A mW Vrms C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.
Electrical absolute maximum ratings are at 25C
Electrical Characteristics
Parameter Output Characteristics Load Current 1 Peak Continuous Continuous Continuous On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current 3 Input Dropout Current Input Voltage Drop Reverse Input Current Common Characteristics Capacitance Input to Output
1 2 3
Conditions TA=25C t 10ms No Heat Sink TC=25C TC=99C IL=1A, IF=10mA VL=60V IF=20mA, VL=10V 1MHz, V=25V TA=25C IL=1.0A IF=5mA VR=5V TA=25C -
Symbol
Min
Typ
Max
Units
IL IL(99) RON ILEAK TON TOFF Cout IF IF VF IR CI/O
-
-
30 4 24 5.35 0.08 1 20 5 10 1.4 10 -
AP ADC A ms pF mA mA V A pF
0.6 0.9 -
0.05 5 0.13 1250 1.2 1
Higher load currents possible with proper heatsinking. Measurement taken within 1 second of on time. For applications requiring high temperature operation (greater than 60oC) an LED drive current of 20mA is recommended.
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CPC1708
Thermal Characteristics
Parameter Thermal Resistance (junction to case) Thermal Resistance (junction to ambient) Junction Temperature Conditions Free air Symbol RJC RJA TJ Min -40 Typ 45 Max 0.35 100 Units C/W C/W C
Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5C/W.
Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations. Heat Sink Rating
RCA =
(TJ - TA) IL(99)2 IL
2
*
RJC
- RJC
TJ = Junction Temperature (C), TJ 100C * TA = Ambient Temperature (C) IL(99) = Load Current with Case Temperature @ 99C (Arms) IL = Desired Operating Load Current (Arms), IL IL(MAX) RJC = Thermal Resistance, Junction to Case (C/W) = 0.35C/W RCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (C/W) * Elevated junction temperature reduces semiconductor lifetime.
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CPC1708
PERFORMANCE DATA*
CPC1708 Typical LED Forward Voltage Drop (N=50, TA=25C, IF=10mA) CPC1708 Typical On-Resistance Distribution (N=50, TA=25C, IL=1ADC, IF=10mA) CPC1708 Typical Turn-On Time (N=50, TA=25C, IL=1ADC, IF=20mA)
35 30 Device Count (N)
35 30 Device Count (N) 25 20 15 10 5 0
35 30 Device Count (N) 25 20 15 10 5 0
25 20 15 10 5 0 1.30 1.31 1.32 1.33 1.34 LED Forward Voltage (V)
0.040
0.045 0.050 0.055 0.060 On-Resistance ()
0.065
2.9
4.0
5.1
6.2
7.3
8.4
Turn-On (ms)
30 24 18 12 6 0
CPC1708 Typical Turn-Off Time (N=50, TA=25C, IL=1ADC, IF=20mA)
25 20 15 10 5
CPC1708 Typical Maximum Load Current vs. Temperature with Heat Sink (IF=20mA)
1C/W
CPC1708 Typical Leakage vs. Temperature at Maximum Rated Voltage (Measured Across Pins 1 & 2)
0.07 0.06 Leakage (A) 0.05 0.04 0.03 0.02 0.01
Device Count (N)
Load Current (A)
5C/W 10C/W Free Air
0 0.108 0.116 0.124 0.132 0.140 0.148 Turn-Off (ms)
0
20
40
60
80
100
0 -40
-20
0
20
40
60
80
100
Temperature (C)
Temperature (C)
CPC1708 Blocking Voltage vs. Temperature
185 180 Blocking Voltage (VP) 175 170 165 160 155 150 145 -40 -20 0 20 40 60 80 100 Temperature (C) Turn-On (ms) 14 12
CPC1708 Typical Turn-On vs. Temperature (IL=1ADC)
I F = 10mA Turn-Off (ms)
0.16 0.14 0.12 0.10 0.08 0.06 0.04
CPC1708 Typical Turn-Off vs. Temperature (IL=1ADC)
10 8 6 4 2 0 -40 -20 0
I F = 20mA
I F = 20mA
20 40 60 Temperature (C)
80
100
0.02 -40
I F = 10mA -20 0 20 40 60 Temperature (C) 80 100
CPC1708 Typical LED Forward Voltage Drop vs. Temperature
LED Forward Voltage Drop (V) 1.8 1.6 Turn-On (ms) 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 Temperature (C) 100 120
I F = 50mA I F = 20mA I F = 10mA
12 11 10 9 8 7 6 5 4 3 2 1 0
CPC1708 Typical Turn-On vs. LED Forward Current (IL=1ADC)
0.18 0.16 0.14 Turn-Off (ms) 0.12 0.10 0.08 0.06 0.04 0.02 0.00
CPC1708 Typical Turn-Off vs. LED Forward Current (IL=1ADC)
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
Unless otherwise specified, all performance data was acquired without the use of a heat sink. *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
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CPC1708
PERFORMANCE DATA*
CPC1708 Typical IF for Switch Operation vs. Temperature (IL=1ADC) CPC1708 Typical On-Resistance vs. Temperature (IL=1ADC)
5.0 4.0 3.0 2.0 1.0 0.0 0 0.05 0.10 0.15 0.20 0.25 0.30 Load Voltage (V)
4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0 -40
0.08 0.07 On-Resistance ()
CPC1708 Typical Load Current vs. Load Voltage (TA=25C, IF=10mA)
LED Current (mA)
0.05 0.04 0.03 0.02 0.01
I F = 10mA
-20
0
20 40 60 Temperature (C)
80
100
0
-40
-20
0
20
40
60
80
100
Temperature (C)
0.09 0.08 On-Resistance () 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00
CPC1708 Typical On-Resistance vs. Temperature (IL=max rated)
I F = 10mA
CPC1708 Energy Rating Curve (Free Air, No Heat Sink)
35 30 Load Current (A) 25 20 15 10 5
-40
-20
0
20 40 60 Temperature (C)
80
100
0 10s 100s 1ms 10ms 100ms Time
1s
10s 100s
Unless otherwise specified, all performance data was acquired without the use of a heat sink. *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
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Load Current (A)
0.06
5
MANUFACTURING INFORMATION
Soldering For proper assembly, the component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy. Washing Clare does not recommend ultrasonic cleaning or the use of chlorinated solvents.
RoHS
2002/95/EC
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MECHANICAL DIMENSIONS:
i4-PAC
0.190 MIN - 0.205 MAX (4.83 MIN - 5.21 MAX) 0.046 MIN - 0.085 MAX (1.17 MIN - 2.16 MAX) 0.770 MIN - 0.799 MAX (19.56 MIN - 20.29 MAX) 0.210 MIN - 0.244 MAX (5.33 MIN - 6.20 MAX) 0.065 MIN - 0.080 MAX (1.65 MIN - 2.03 MAX) 0.660 MIN - 0.690 MAX (16.76 MIN - 17.53 MAX)
ISOLATED HEAT SINK 0.100 MIN - 0.180 MAX (2.54 MIN - 4.57 MAX) 0.819 MIN - 0.840 MAX (20.80 MIN - 21.34 MAX) 0.590 MIN - 0.620 MAX (14.99 MIN - 15.75 MAX)
0.083 MIN - 0.102 MAX (2.11 MIN - 2.59 MAX)
0.780 MIN - 0.840 MAX (19.81 MIN - 21.34 MAX)
0.300 BSC (7.62 BSC)
0.150 BSC (3.81 BSC)
0.020 MIN - 0.029 MAX (0.51 MIN - 0.74 MAX)
0.058 MIN - 0.068 MAX (1.47 MIN - 1.73 MAX) 0.045 MIN - 0.055 MAX (1.14 MIN - 1.40 MAX)
0.102 MIN - 0.118 MAX (2.59 MIN - 3.00 MAX)
NOTE: Bottom heatsink meets 2500Vrms isolation to the other pins.
Dimensions: inches (mm)
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1708-R01 (c)Copyright 2007, Clare, Inc. OptoMOS(R) is a registered trademark of Clare, Inc. i4-PACTM is a trademark of IXYS Corporation All rights reserved. Printed in USA. 3/20/07
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